how do I solve for the Income method using tje earning capitalization approach and the liquidation approach

1987 1986 1955 $104 $106 79 66 $83 134 92 $308 241 (61) 180 94 73 $272 179 (45) 134 278 125 (33) 92 $488 $406 $343 72 7 55 6 remove the resist. This produces an alkaline polymer sludge, which must be chemi- The boards are then run through a conveyor etcher. The etching process re- moves the exposed copper areas by chemically degrading the copper coating down to the fiberglass substrate of the board. The ammonia-based etching solution does not attack the tin/lead plating. This leaves the copper traces under the tin/lead plating in- fact and the rest of the board exposed fiberglass. The ammonia-based solution of dis- solved copper must be removed by an authorized hazardous waste hauler. traces. A photownsitive epoxy ink called solder mask, is applied to the boards to The tin/lead is then chemically stripped from the pathways exposing the copper cover the traces but leave the holes and surface mount pada 148 Shaker Circuits (A) EXHIBIT 8.2 Shaker Circuits balance sheet. 1989 1988 Assets Cash & marketable securities $185 $132 Accounts receivable 153 196 Inventory 89 129 Total current assets $427 $457 Property plant & equipment 286 Accumulated depreciation (99) (80) Property plant & equipment (net) 188 198 Other assets Total assets $615 $656 Liabilities Accounts payable 107 112 Short term debt 11 Total current liabilities $118 $124 Long term debt 130 100 Total liabilities $248 $224 Owners equity Common stock 150 150 Retained earnings 218 283 Total equity $365 $433 Total liabilities & equity $616 $656 hauler The boards are then nin shimmel 50 5 $ 54 90 $ 79 90 $ 61 100 $169 $161 $144 150 169 150 49 150 96 $246 8319 $199 8488 $407 $344 cally neutralized and dried prior to being hauled away by a certified hazardous waste 1987 1986 1955 $104 $106 79 66 $83 134 92 $308 241 (61) 180 94 73 $272 179 (45) 134 278 125 (33) 92 $488 $406 $343 72 7 55 6 remove the resist. This produces an alkaline polymer sludge, which must be chemi- The boards are then run through a conveyor etcher. The etching process re- moves the exposed copper areas by chemically degrading the copper coating down to the fiberglass substrate of the board. The ammonia-based etching solution does not attack the tin/lead plating. This leaves the copper traces under the tin/lead plating in- fact and the rest of the board exposed fiberglass. The ammonia-based solution of dis- solved copper must be removed by an authorized hazardous waste hauler. traces. A photownsitive epoxy ink called solder mask, is applied to the boards to The tin/lead is then chemically stripped from the pathways exposing the copper cover the traces but leave the holes and surface mount pada 148 Shaker Circuits (A) EXHIBIT 8.2 Shaker Circuits balance sheet. 1989 1988 Assets Cash & marketable securities $185 $132 Accounts receivable 153 196 Inventory 89 129 Total current assets $427 $457 Property plant & equipment 286 Accumulated depreciation (99) (80) Property plant & equipment (net) 188 198 Other assets Total assets $615 $656 Liabilities Accounts payable 107 112 Short term debt 11 Total current liabilities $118 $124 Long term debt 130 100 Total liabilities $248 $224 Owners equity Common stock 150 150 Retained earnings 218 283 Total equity $365 $433 Total liabilities & equity $616 $656 hauler The boards are then nin shimmel 50 5 $ 54 90 $ 79 90 $ 61 100 $169 $161 $144 150 169 150 49 150 96 $246 8319 $199 8488 $407 $344 cally neutralized and dried prior to being hauled away by a certified hazardous waste