open -note quiz. 1- (100 points). A silicon chip of thickness L = 2.0 mm and thermal conductivity k = 135 W/m K is cooled by boiling a saturated fluorocarbon liquid (Tsat = 57C) on its upper surface. The electronics circuits are located on the bottom of the chip and produce a heat flux of q. Saturated fluorocarbon 06 Silicon chip To 111111 9% Properties of the saturated fluorocarbon are Cpl = 1100 J/kg K, Cp,v=2174 J/kg K, hfg= 84,400 J/kg, pl = 1619 kg/m, p = 13.4 kg/m, o=8.1103 N/m, u=440106 kg/m's and Pri=9.0. The nucleate boiling constants are Csf= 0.005, n = 1.7. max a. (40 points). Determine the critical heat flux, q", for this boiling process. As evident in the schematic above, the lateral dimension of the chip is large compared to the typical bubble diameter. max , b. (40 points). If the circuits are operated so that q" = 0.80 q" determine the top surface temperature of the chip, Ts, and the temperature at the bottom of the chip, To. a fluorocarbon c. (20 points). If the circuits were to be operated so that q" = 1.2qmax> salesperson wearing an expensive suit claims that the excess temperature, ATe, will increase by a factor of 1.2/0.8 relative to the excess temperature associated with part (b). The salesperson has 10 years of experience selling fluorocarbons and is 20 years older than you. Is the salesperson correct? Explain your answer (in no more than two sentences) using the knowledge you've gained by attending class and reading the book. Are you sure of your answer?