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Problem 1 Assume a color display using 8 bits for each of the primary colors (red, green, blue) per pixel and a frame size of

Problem 1

Assume a color display using 8 bits for each of the primary colors

(red, green, blue) per pixel and a frame size of 1280 1024.

a. What is the minimum size in bytes of the frame buff er to store a frame?

b. How long would it take, at a minimum, for the frame to be sent over a 100

Mbit/s network?

Problem 2

Consider three different processors P1, P2, and P3 executing

the same instruction set. P1 has a 3 GHz clock rate and a CPI of 1.5. P2 has a

2.5 GHz clock rate and a CPI of 1.0. P3 has a 4.0 GHz clock rate and has a CPI

of 2.2.

a. Which processor has the highest performance expressed in instructions per second?

b. If the processors each execute a program in 10 seconds, find the number of

cycles and the number of instructions.

c. We are trying to reduce the execution time by 30% but this leads to an increase

of 20% in the CPI. What clock rate should we have to get this time reduction?

Problem 3

If the total dissipated power is to be reduced by 10%, how much

should the voltage be reduced to maintain the same leakage current? Note: power

is defined as the product of voltage and current.

Problem 4

Suppose that we are developing a new version of the AMD

Barcelona processor with a 4 GHz clock rate. We have added some additional

instructions to the instruction set in such a way that the number of instructions

has been reduced by 15%. Th e execution time is reduced to 700 s and the new

SPEC ratio is 13.7. Find the new CPI.

Problem 5

Assume a 15 cm diameter wafer has a cost of 12, contains 84 dies, and has

0.020 defects/cm2. Assume a 20 cm diameter wafer has a cost of 15, contains 100

dies, and has 0.031 defects/cm2.

5. 1 Find the yield for both wafers.

5.2 Find the cost per die for both wafers.

5.3 If the number of dies per wafer is increased by 10% and the

defects per area unit increases by 15%, find the die area and yield.

5.4 Assume a fabrication process improves the yield from 0.92 to

0.95. Find the defects per area unit for each version of the technology given a die

area of 200 mm2.

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