Question
Problem 1 Assume a color display using 8 bits for each of the primary colors (red, green, blue) per pixel and a frame size of
Problem 1
Assume a color display using 8 bits for each of the primary colors
(red, green, blue) per pixel and a frame size of 1280 1024.
a. What is the minimum size in bytes of the frame buff er to store a frame?
b. How long would it take, at a minimum, for the frame to be sent over a 100
Mbit/s network?
Problem 2
Consider three different processors P1, P2, and P3 executing
the same instruction set. P1 has a 3 GHz clock rate and a CPI of 1.5. P2 has a
2.5 GHz clock rate and a CPI of 1.0. P3 has a 4.0 GHz clock rate and has a CPI
of 2.2.
a. Which processor has the highest performance expressed in instructions per second?
b. If the processors each execute a program in 10 seconds, find the number of
cycles and the number of instructions.
c. We are trying to reduce the execution time by 30% but this leads to an increase
of 20% in the CPI. What clock rate should we have to get this time reduction?
Problem 3
If the total dissipated power is to be reduced by 10%, how much
should the voltage be reduced to maintain the same leakage current? Note: power
is defined as the product of voltage and current.
Problem 4
Suppose that we are developing a new version of the AMD
Barcelona processor with a 4 GHz clock rate. We have added some additional
instructions to the instruction set in such a way that the number of instructions
has been reduced by 15%. Th e execution time is reduced to 700 s and the new
SPEC ratio is 13.7. Find the new CPI.
Problem 5
Assume a 15 cm diameter wafer has a cost of 12, contains 84 dies, and has
0.020 defects/cm2. Assume a 20 cm diameter wafer has a cost of 15, contains 100
dies, and has 0.031 defects/cm2.
5. 1 Find the yield for both wafers.
5.2 Find the cost per die for both wafers.
5.3 If the number of dies per wafer is increased by 10% and the
defects per area unit increases by 15%, find the die area and yield.
5.4 Assume a fabrication process improves the yield from 0.92 to
0.95. Find the defects per area unit for each version of the technology given a die
area of 200 mm2.
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