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Problem I [40%] Find the number of dies per 300 mm wafer for die size of: (a) 1.5 cm on a side. (b) 1.0 cm
Problem I [40%] Find the number of dies per 300 mm wafer for die size of: (a) 1.5 cm on a side. (b) 1.0 cm on a side. A defect density of 0.047 per cm2 and N is 8. Find the die yields for dies that are: (c) 1.5 cm on a side. (d) 1.0 cm on a side
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