The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2002 and 0.2157 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.) i (b) Determine the mean of X. (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X. (Round your answer to 8 decimal places.) i micrometers? Statistical Tables and Charts