The wafer size of 8 inches is used to produce die size of 2.5 cm2 area costs Rs. 5,00,000. The total cost of die testing and packaging is Rs. 3,50,000. During testing it is found that 10% of total die produced are faulty. Find the cost per IC production. Consider the defect density as 1 defects/cm2 , a= 3 (measure of manufacturing process complexity, Rs. 8,00,000 is consumed in design and layout of IC).