Thin lms of two different metals [TI and Au} are deposited sequentially onto a substrate using an evaporation technique. After the deposition ofTi. the lm thickness is measured and 20% are detem'lined to be too thick, 5% too thin. and the remaining are ofa good thickness. The substrates with TI that is too thick do not make itto the Au deposition step. lithe lms were too thin, another round of TI deposition is performed. From the second round of deposition. 35% are now of good thickness and move on to the Au deposition step. and the rest are too thick. a. Given TI was only deposited once. what is the probability that the substrate did not make it to Au deposition? Show your work. {6 points} b. Given that the substrate gets to the Au Deposition step. what is the probability that Ti was deposited on ittwioe'? Show your work. {E points]