This Intel Pentium4 is rated to dissipate a maximum heat of 40,000 W/m2. In 2005 customers claimed that desktops and Laptops using the Pentium4 processor were experiencing overheating problems, an indication that the original cooling system proposed by Intel may not have been effective. A new solution was therefore required for this system.

To demonstrate a design approach you are asked to validate your design by repeating the calculation by using Ansys Fluent.

Your Part-I of the design should respond to the following restrictions: 1. Maximum temperature of the processor (free surface heater) can not exceed 55C 2. Maximum height of the packaging and cooling system can not exceed 25 mm 3. Materials of the cooling system should be compatible with existing Pentium4 packaging system 4. Cost of the cooling system can not exceed $25/unit

Description: You are asked to design a system that will improve the cooling system for microprocessois that resembles the Intel Pentium34. The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (HS) is attached to the package substrate and core and serves as the mating surface for processor component thermalsolutions The figure below shows a sketch of the processor package components and how they are assembled together [3] IHS Core (die) Substrate Capacitors LGA775 Socket System Board NOTE 1. Socket and motherboard are included for reference and are not part of processor package 75 70 65 60 Heatsink Design Point Thermal Profile E 50 40 30 4050 60 70 80 90 100 110 Watts Figure 2: Thermal Pr ofile for PentiumB4 [5]