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Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect(1st Edition)

Authors:

Jie Cheng

Free research on chemical mechanical polishing mechanism of novel diffusion barrier ru for cu interconnect 1st
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Cover Type:Hardcover
Condition:Used

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Book details

ISBN: 9811355851, 978-9811355851

Book publisher: Springer