59. The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A
adhesive type, factor B
cure time, and factor C

conductor material (copper and nickel). The data follows, along with an ANOVA table from MINITAB. What conclusions can you draw from the data?

Copper Cure Time 1 23 72.7 74.6 80.0 1 80.0 77.5 82.7 77.8 78.5 84.6 Adhesive 2 75.3 81.1 78.3 77.3 80.9 83.9 3 76.5 82.6 85.0 Nickel 1 2 3 74.7 75.7 77.2 1 77.4 78.2 74.6 79.3 78.8 83.0 Adhesive 2 77.8 75.4 83.9 77.2 84.5 89.4 3 78.4 77.5 81.2 Analysis of Variance for strength Source DF SS MS F P Adhesive 2 101.317 50.659 6.54 0.007 Curetime 2 151.317 75.659 9.76 0.001 Conmater 1 0.722 0.722 0.09 0.764 Adhes*curet 4 30.526 7.632 0.98 0.441 Adhes*conm 2 8.015 4.008 0.52 0.605 Curet*conm 2 5.952 2.976 0.38 0.687 Adh*curet*conm 4 33.298 8.325 1.07 0.398 Error 18 139.515 7.751 Total 35 470.663