An article in the IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1992, Vol. 15) described an
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(a) Is there any indication that either solder bump size or alignment method affects the alignment accuracy? Is there any evidence of interaction between these factors? Use a = 0.05.
(b) What recommendations would you make about this process?
(c) Analyze the residuals from this experiment. Comment on model adequacy.
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Related Book For
Applied Statistics And Probability For Engineers
ISBN: 9781118539712
6th Edition
Authors: Douglas C. Montgomery, George C. Runger
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