A transparent film is to be bonded onto the top surface of a solid plate inside a heated chamber. For the bond to cure properly, a temperature of 70°C is to be maintained at the bond, between the film and the solid plate. The transparent film has a thickness of 1 mm and thermal conductivity of 0.05 W/m⋅K, while the solid plate is 13 mm thick and has a thermal conductivity of 1.2 W/m⋅K. Inside the heated chamber, the convection heat transfer coefficient is 70 W/ m²⋅K. If the bottom surface of the solid plate is maintained at 52°C, determine the temperature inside the heated chamber and the surface temperature of the transparent film. Assume thermal contact resistance is negligible.

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Ti Air, h= 70 W/m².K Solid plate k, = 1.2 W/m-K L = 1 mm L, = 13 mm FIGURE P17-27 Transparent film k=0.05 W/m-K Tb = 70°C T₂ = 52°C