The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a

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The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A adhesive type, factor B curve time, and factor C

conductor material (copper and nickel). The data follows, along with an ANOVA table from Minitab. What conclusions can you draw from the data?

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Probability And Statistics For Engineering And The Sciences

ISBN: 9781133169345

8th Edition

Authors: Jay L Devore, Roger Ellsbury

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Question Posted: Sep 21, 2024 11:03 AM

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Probability And Statistics For Engineering And The Sciences

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