1. If a die yield for a 200mm^2 wafer is initially 0.80 and the process improves to 0.90, what is the defects per area for both versions? Also: wafer-yield is 1.

2. A program requires 300 s to run. Of this, 85 s are spent executing FP (floating point math) instructions, 100 s are spent executing L/S (load/store) instructions, and 62 s are spent executing branch instructions. (30 pts) a) The remaining time is assumed to be INT (integer ALU) instructions. How much time would that be? b) If nothing else changes, but the time spent executing L/S instructions is reduced by 20%, how much time is saved (in percent of the original)? c) A change was made to the ALU design, causing INT instructions to run 5% faster. If all other instruction types take the same amount of time, how long (in s) does it take for the program to complete?

P.S : Include all units in calculations