12 Screen: Quality measured by the height of the material deposited, through a control chart Nominal 10 mils USL LSL 8 Control Chart: Xdouble bar 9.75 Reject Rate %, UCLX PPM, Yield 10.75 LCLX % Cp 8.75 Sample Size Cpk_ 4 Place: Quality measured by the defect rate obtained, using nP chart, assume process centered and two-sided specification limit Reject rate 4 in 10,000, Cpk %, PPM, Yield % Oven Quality measured by # solder shorts in 1000 parts, using C chart, assume process centered and one sided specification limit Nominal 6 shorts/1000 parts C chart: Cbar Reject Rate %, PPM, Yield % UCLC LCLC Cpk Total Process: Quality measured by all defects in the line of three machines, assume process centered and two sided specification limit Reject Rate %, PPM, Yield % Cp Cpk