A 16-run experiment was performed in a semiconductor manufacturing plant to study the effects of six factors on the curvature or camber of the subsrate devices produced. The six variables and their levels are given in the data below Temperature("C Firing Temperaturefiring Cycle Firing Dewl Time(h) Camber C) Run Time(sec) Pressure(tn) ToC) 55 10 5 1580 17.5 20 156.75 2 75 10 5 1580 29 26 48.0 3 55 25 5 1580 29 20 44.0 4 75 25 1580 17.5 26 55.75 5 55 10 10 1580 29 26 55.75 6 75 10 10 1580 17.5 20 230.0 7 55 25 10 1580 17.5 26 97.25 8 75 25 10 1580 29 20 225.0 9 55 10 1620 17.5 26 50.25 10 75 10 1620 29 20 85.25 11 55 25 5 1620 29 26 31.5 12 75 25 5 1620 17.5 20 160.0 13 55 10 10 1620 29 20 113.75 14 75 10 10 1620 17.5 26 92.75 15 55 25 10 1620 17.5 20 150.75 16 75 25 10 1620 29 26 115 1. What type of design did the experimenters use. 2. What are the alias relationship in this design? 3. Do any of the process variables affect average camber? 4. If it is important to reduce camber as much as possible, what recommendations would you make?