A 16-run experiment was performed in a semiconductor manufacturing plant to study the effects of six factors on the curvature or camber of the substrate devices produced. The six variables and their levels are shown below:

Each run was replicated four times, and a camber measurement was taken on the substrate. The data are shown below:

(a) What type of design did the experimenters use?

(b) What are the alias relationships in this design?

(c) Do any of the process variables affect average camber?

(d) Do any of the process variables affect the variability in camber measurements?

(e) If it is important to reduce camber as much as possible, what recommendations would you make?

Table 8.31

Transcribed Image Text:

Firing Сycle Time Firing Dew Lamination Lamination Lamination Temperature (°C) Firing Temperature (°C) Point (°C) Time Pressure Run (s) (tn) (h) 1 55 10 5 1580 17.5 20 2 75 10 5 1580 29 26 3 55 25 5 1580 29 20 4 75 25 5 1580 17.5 26 5 55 10 10 1580 29 26 6. 75 10 10 1580 17.5 20 7 55 25 10 1580 17.5 26 8 75 25 10 1580 29 20 9. 55 10 5 1620 17.5 26 10 75 10 5 1620 29 20 11 55 25 5 1620 29 26 12 75 25 5 1620 17.5 20 13 55 10 10 1620 29 20 14 75 10 10 1620 17.5 26 15 55 25 10 1620 17.5 20 16 75 25 10 1620 29 26