An etching solution for silicon wafers is made up of four parts (by volume) of concentrated hydrofluoric acid to one part concentrated nitric acid to three parts concentrated acetic acid. The hydrofluoric acid is 49% (by mass) HF, and has s specific gravity of 1.198 ; the nitric acid is 70%HNO3, with a specific gravity of 1.413 , and the acetic acid is pure CH3CO2H with a specific gravity of 1.049 . a. How many liters of each acid will be required to make up 100kg of etching solution? b. What is the molarity (moles per liter) of HF and HNO3 in the etching solution