c) Use the SEED's model, if D=4 defects/cm, (i) What is the yield for: Chip A: Chip B: a 1mm by 1mm a 7mm by 7mm a 1.2cm by 1.2cm Chip C: (ii) How many good chips for "Chip A", "Chip B" and "Chip C" from a 6" wafer? (iii) If the packaging costs for "each" Chip A = 1.5; Chip B = 12 and Chip C = 35. The fabrication* cost of a 6" wafer is 400. Assume that an electronic system can use either 500 Chip A, or 120 Chip B, or 20 Chip C. Which is the most economic solution based on these packaging and processing costs? Fabrication is a manufacturing process.