Calculate the maximum dies per wafer, yield, and cost per die for each of the fabrication nodes $($i$.$e Processor A on Process Node X$,$ Processor A on Process Node Y$,$ etc.$)$ based on the information provided. You should use a $300mm$ diameter wafer for all calculations.

Processor A

Size: $9mm8mm$

Processor B

Size: $14mm21mm$

Process Node X

Cost per wafer: $$5,000$

Defect Density: $008$ defects per $m{m}^2$

Pracess Node Y:

Cost per wher: $$10,000$

Defect Density: $001$ defects per $m{m}^2$

Using the online calculator at

https:$//$harshari$.$github.io$/$yield$.$html calculate the maximum dies per wafer, yeld, and cost per die for each of the $4$ combinations of processor and node as in question $2.$ Note that the calculator states that it takes inputs for the defect density in defects per sq$.$ cm$.,$ it seems as though it is mislabeled and actually uses sq$.$ mm$.$