Problem 1 In the cell phone manufacturing industry, a transparent glass layer is bonded to the screen as shown in the figure. The bond between the glass layer and the screen is cured at a temperature T using radiant energy, which can be modeled as heat flux absorbed at the bonded surface. The back of the screen is maintained at T, while the free surface of the glass layer is exposed to air at T and a convection heat transfer coefficient h. Th L, = 0.25 mm bond L glass To L = 1.0 mm L OLED screen k = 0.025 W/m.K k = 0.05 W/m-K T 1- Sketch the thermal curcuit representation of this steady-state bonding process (label all circuit elements, nodes and heat rates) 2- Develop an expression for the heat flux , required to maintain the bonded surface at T = 60C, when T = 20C, h = 50 W/m K and T = 30C. 3- Using Excel or Matlab, compute and plot the required heat flux as a function of L, over the range 0 Problem 2 Steam (steam = 320C) flows in a stainless-steel pipe (k = 15 W/m.K, inner diameter D =5 cm, outer diameter D = 5.5 cm). The steam heat Th transfer coefficient inside the pipe is h = 80 W/m. K. The pipe is covered with 3-cm-thick glass wool insulation (thickness t=3 cm, k = 0.038 W/m K). Heat is ins steam k ins D surroundings Th sur ME 3440-Spring 2024 HW4 (due: 2/09) sur KENNESAW STATE UNIVERSITY lost to the surroundings (T = 5C) by natural convection and radiation, with a combined natural convection and radiation heat transfer coefficient h = 15 W/mK. 1- Determine the rate of heat loss from the steam per unit length of the pipe (O/L) [solution: Q = 93.9 W/m ] 2- Determine the temperature drop across the pipe shell and the insulation 3- Considering a range of insulation thickness 1