Suppose that your company currently produces a die with an area of 25mm^2 using a 100 mm diameter wafer with a process that costs $100/ wafer and has 2 defects/cm^2. Howerer, the compromise is that the new process which allows the die area to be cut in half. However, the compromise is that the new process costs 30% more and has 10 defects/cm^2. Is it economical to make the change to the new process?