Refer to the Soldering & Surface Mount Technology (Vol. 13, 2001) study to compare four soldering methods, Exercise 14.24. Recall that a measure of plastic hardening (Nm/m²) was obtained for each solder type at each of six different temperatures. The data are reproduced in the table. Analyze the data using the appropriate nonparametric method. Interpret the results at α = .10.

Data from Exercise 14.24

Traditionally, solders used in electronics assembly are made with lead. Due to numerous environmental hazards associated with lead solders (e.g., groundwater contamination and breathing in of fine lead-bearing particles), engineers are developing lead-free solders. In Soldering & Surface Mount Technology (Vol. 13, 2001), researchers compared the traditional tin–lead alloy solder to three lead-free alloys: tin–silver, tin–copper, and tin–silver–copper. A measure of plastic hardening (Nm/m²) was obtained for each solder type at each of six different temperatures. The data are given in the table.

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LEADSOLDER Tin-Silver- Temperature Tin-Lead Tin-Silver Tin-Copper Copper 23°C 50.1 33.0 14.9 41.0 50°C 24.6 27.7 10.5 20.7 75°C 23.1 10.7 9.3 17.1 100°C 1.8 9.0 8.8 8.7 125°C 1.1 4.9 5.4 7.1 150°C 0.3 3.2 5.0 4.9