Failure times of silicon wafer microchips. Researchers at National Semiconductor experimented with tin-lead solder bumps used to manufacture silicon wafer integrated circuit chips (International Wafer Level Packaging Conference, Nov. 3–4, 2005). The failure times of the microchips (in hours) were determined at different solder temperatures

(degrees Celsius). The data for one experiment are given in the following table. The researchers want to predict failure time (y) based on solder temperature (x).

a. Construct a scatterplot for the data. What type of relationship, linear or curvilinear, appears to exist between failure time and solder temperature?

b. Fit the model, E1y2 = b0 + b1x + b2x2, to the data.

Give the least squares prediction equation.

c. Conduct a test to determine if there is upward curvature in the relationship between failure time and solder temperature.

(Use a = .05.)

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Temperature (C) 165 162 Time to Failure (hours) 200 200 164 1,200 158 500 158 600 159 750 156 1,200 157 1,500 152 500 147 500 149 1,100 149 1,150 142 3,500 142 3,600 143 3,650 133 4,200 132 4,800 132 5,000 134 5,200 134 5,400 125 8,300 123 9,700