Silicon wafer is susceptible to warping when the wafer is subjected to temperature difference across its thickness. Thus, steps needed to be taken to prevent the temperature gradient across the wafer thickness from getting large. As an engineer in a semiconductor company, your task is to determine the maximum allowable heat flux on the bottom surface of the wafer, while maintaining the upper surface temperature at 27°C. To prevent the wafer from warping, the temperature difference across its thickness of 500 mm cannot exceed 1°C.

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