1) Define the following terms: interconnect, contact, via, and plug. 2) What metal has traditionally been used for interconnect wiring, and what is its replacement? 3) List and describe the seven performance requirements for metals used in wafer fabrication. 4) List the categories of metals and metal alloys used in semiconductor manufacturing 5) Explain why aluminum has been the interconnect metal of choice for microchips. 6) Describe junction spiking and list the two primary ways it was resolved. 7) Discuss electromigration and how it affects reliability. How is electromigration controlled in aluminum wiring? 8) List and discuss the five benefits for introducing copper metallization. 9) Explain what a barrier metal is and the essential properties of a barrier material. What metals are commonly used a barrier metal? 8) List and discuss the five benefits for introducing copper metallization. 9) Explain what a barrier metal is and the essential properties of a barrier material. What metals are commonly used a barrier metal? 10) Define silicide and explain why refractory metal silicides are important in wafer fabrication. 11) What are the benefits of titanium silicide