An article in Wood Science and Technology ["Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125- 144)] reported a study of the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data follow: Stress Level, x (%) 54 54 61 61 68 68 75 75 75 Deflection, y (mm) 16.473 18.693 14.305 15.121 13.505 11.640 11.168 12.534 11.224 How much variability (in %) in data does the fitted linear regression model capture