The accompanying data on and appeared in the article

“Plating of 60/40 Tin/Lead Solder for Head Termination Metallurgy” (Plating and Surface Finishing, Jan. 1997:

y 5 rate of deposition(mm/min )

x 5 current density (mA/cm2

)

gyi 2 5 17,454 gxi yi 5 25,825 gyi 5 346 gxi 2 5 39,095 n 5 14 gxi 5 517 y 5 BOD x 5 BOD 38–40). Do you agree with the claim by the article’s author that “a linear relationship was obtained from the tin-lead rate of deposition as a function of current density”? Explain your reasoning.

x 20 40 60 80 y .24 1.20 1.71 2.22